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Bridgelux Announces U.S. Patent Award For Surface Mountable Led Chip

Company Continues to Strengthen its IP Portfolio

SUNNYVALE, CALIF., January 15, 200 — Bridgelux, Inc.,
a leading supplier of energy-saving light-emitting diode (LED) technology
for high-volume, solid-state lighting markets, today announced the award
of a U.S. patent for its surface mountable chip (SMC) LED design. This
SMC architecture fundamentally changes how LEDs will be deployed by eliminating
the need for traditional LED packaging. The innovative chip design offers
a high flux density LED with an ultra small footprint and thin profile,
with the ability to closely pack multiple chips together for increased
performance in space limited applications such as camera flash, LCD display
backlighting and general or specialty lighting applications. The design
of this chip also delivers a surface mountable “thin-film” architecture,
providing a flat surface for direct deposition of a phosphor layer on
the LED die.

Since the founding of Bridgelux, the Company has invested in the development
of its IP portfolio relating to MOCVD reactor design, leading-edge epi
technologies, advanced LED chip design, manufacturing processes and innovative
packaging techniques. To accomplish this, Bridgelux has assembled a world-class
team of seasoned technologists, expert in the LED and solid-state lighting
(SSL) industries.

“This new patent award demonstrates Bridgelux’s focus on driving innovation
in core technologies to improve performance and reduce the cost of our
lighting technologies,” noted Bridgelux’s director of R&D, Steve Lester.
“The company is aggressively adding to its intellectual property (IP)
portfolio. Bridgelux, currently, has over 75 patents filed in the U.S.
and over 130 patent applications filed worldwide. Bridgelux’s investments
in MOCVD and chip design enable the Company to continue to innovate and
deliver the right quality and quantity of light for specific SSL applications.”

The Bridgelux SMC LED design will enable manufacturers to bond the chip
directly onto the printed circuit board (PCB), eliminating the need for
an additional substrate or traditional LED package. This is the first
discrete, thin-film device with two bottom contacts and a flat surface
on which a phosphor can be applied. Direct deposition of phosphor film
at either the wafer or package level can achieve a quality of white color
consistency that no other commercially available LED die platform can
currently offer. Bridgelux intends to manufacture LED chips using its
SMC design at the Company’s state-of-the-art manufacturing facility in
Sunnyvale, Calif., or where appropriate, through one of its manufacturing

With this innovative chip design, non-value add components or manufacturing
processes can be eliminated, gaining the ability to enhance system integration
and reduce the cost of the total lighting solution. This chip will deliver
greater manufacturing flexibility for high flux applications requiring
multiple emitters, enable higher flux density for etandue limited applications,
and allow for individual chip addressability via the board to which multiple
SMCs are attached.

About Bridgelux

Focused on bringing innovation to light, Bridgelux is a leading provider
of high-power, cost-effective and energy-efficient light-emitting diode
(LED) solutions. The company’s proprietary epitaxy technology, innovative
chip designs and leading-edge LED packaging technology have enabled the
company to develop advanced solid-state lighting (SSL) products that offer
superior quality, are lower in cost and environmentally friendly—all without
compromising performance. In addition to LED chips, the company delivers
a range of SSL light sources enabling OEM customers to easily integrate
into a variety of lighting applications that will open up new markets
in solid-state lighting. Founded in 2002, Bridgelux is headquartered in
Sunnyvale, Calif. For more information about the company, please visit


Brian Fisher


Phone: 408.990.7563


Marie Labrie


Phone: 650.968.8900, ext. 119